New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

At GTC 2025, Nvidia CEO Jensen Huang projected $1 trillion in global data center CapEx by 2028. At this pace, data center ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Xtreme Pooling allows any test processor on a Pin Scale 5000 card to store vector data in other test processors’ ...

SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...

AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...

Researchers from Ulsan National Institute of Science and Technology (UNIST) and Pohang University of Science and Technology ...