Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of ...

New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...

Xtreme Pooling allows any test processor on a Pin Scale 5000 card to store vector data in other test processors’ ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...

Hardware IP Protection through Low-Overhead Fine-Grain Redaction” was published by researchers at University of Florida.